TMG IO-Link Master Test Device

The TMG IO-Link Master Test Device is intended for the system test of IO-Link masters. It does not replace the master test system for the IO-Link conformance test. This only tests the correctness of the protocol processing on one port. For the system test, however, the IO-Link master should be tested on all its ports simultaneously, each with different data lengths and different time behavior. Ideally, test devices should be connected to all ports in order to test the master with the highest load.

Especially for the extreme values of IO-Link configurations there are no, only a few or sometimes expensive IO-Link devices. Therefore TMG TE has developed the IO-Link Master Test Device. This provides a wide range of different IO-Link configurations, which simplify the system test and allow a good test depth. We always recommend to first perform the protocol test with the specified test system and after passing the test to perform the system test with TMG IO-Link Master Test Devices on all ports.

The TMG IO-Link Master Test Device supports the IO-Link Firmware Update Profile, so that we will be able to offer even more configurations and also more test functions in the future.

Test Suite V1.1.2

Test configurations

Test Suite V1.1.2 is described here as an example. Test Suite V1.1.3 has a similar structure.
There are 34 test configurations to choose between.
The following properties of the devices are offered:

Diagnose

In addition to normal IO-Link operation, some detectable protocol errors are detected and counted.

• Number of ISDU Aborts
• Number of Disconnects
• Number of Parity Errors

Set test configurations

The TMG IO-Link Master Test Device realizes the different test configurations by device compatibility. So no new firmware has to be loaded to set up a new test configuration, but this is done by presetting an assigned device ID.

This can be accomplished in two ways:

• Due to Device Compatibility
  The port configuration of the IO-Link master is set to "compatible" or to a backup mode. The vendor ID (TMG, 335, 0x014F) and the device ID for the respective test setting are configured with the respective IODD. When establishing the connection, the IO-Link master will then change the IO-Link master test device to the device ID of the test configuration.
• By parameterization
  If you do not want to make the setting by the port configuration of the IO-Link master, you can also do this by setting a parameter e.g. by the TMG USB IO-Link Master V2 or by the master to be tested itself.

Test Suite: EMV Test

The "TMG IO-Link EMC Test Device" is an additional firmware that can be loaded to the TMG IO-Link Master Test Device via firmware update (included in delivery). The device is used to support IO-Link specific electromagnetic compatibility (EMC) tests. It generates a different random 8-bit process datum in each IO-Link cycle. It checks the process output data received from the IO-Link master and compares it with the previously sent process input data (for more information, see Appendix H of the IO-Link Interface and System Specification V1.1.3). If the output data deviates from the input data, an error counter is incremented. If the IO-Link master sends the same frame twice, a retry counter is incremented. If the TMG IO-Link EMC test device loses the connection to the IO-Link master, a connection loss counter is incremented.

The test suite "TMG IO-Link EMC Test Device" has the following configurations: